Aniruddha Dasgupta, Sunpyo Hong, Hyesoon Kim, Jinil Park,
A New Temperature Distribution Measurement Method on GPU Architectures Using Thermocouples
In recent years, the many-core architecture has seen a rapid increase in the number of on-chip cores with a much slower increase in die area. This has led to very high power densities in the chip. Hence, in addition to power, temperature has become a first-order design constraint for high-performance architectures. However, measuring temperature is very limited to on-chip temperature sensors, which might not always be available to researchers.
In this paper, we propose a new temperature-measurement system using thermocouples for many-core GPU architectures and devise a new method to control GPU scheduling. This system gives us a temperature distribution heatmap of the chip. In addition to monitoring temperature distribution, our system also does run-time power consumption monitoring. The results show that there is a strong corelation between the on-chip heatmap patterns and power consumption. Furthermore, we provide actual experimental results that show the relationship between TPC utilizations and their active locations that reduce temperature and power consumption.