GIT-CERCS-03-12
Jacob Rajkumar Minz, Sung Kyu Lim
Layer Assignment for System on Packages
The routing environment for the new emering mixed-signal System-on-Package
(SOP) technoogy is more advanced than that of the conventional PCB or MCM
technology - pins are located at all layers of SOP packaging substrate rather
than the top-most layer only. We propose a new interconnect-cntric layer
assignment algorithm named LA-SOP that handles arbitrary routing topologies and
produces near optimal results. The contribution of this work is threefold: (i)
modelling of the SOP routing resource, (ii) formulation of the new SOP layer
assignment problem, and (iii) development of a fast and novel algorithm that
considers the various design constraints unique to SOP. We review various
approaches for the PCB, IC and MCM algorithms and investigate their
applicability to the SOP model. Our related experimental results demonstrate
the effectiveness of our algorithm LA-SOP.